Degrees of freedom
6-axis (accel+gyro); 9-axis (+mag)
6-axis vs 9-axis sets heading aiding options.
Magnetometers fail near steel and motors.
Inertial measurement units for orientation, acceleration, and angular rate — fused with LiDAR, cameras, encoders, and GNSS in navigation and control stacks.
TECHNOLOGY VS COMPONENT · IMU VS ENCODER
The Technology Library encoders page covers rotary and linear position feedback. This page covers buyable IMU modules — accelerometer and gyro packages for orientation and motion estimation. See also SLAM for fusion with LiDAR and cameras.
A sensor package combining accelerometers and gyroscopes (often magnetometers) that estimates linear acceleration, angular rate, and attitude — the motion-sensing layer in robot localization and stabilization.
An IMU feels how the robot accelerates and rotates — like the motion sensors in a phone, but engineered for robots. Alone it drifts over time, so teams fuse it with wheel encoders, LiDAR, cameras, or GPS.
MEMS IMUs integrate triaxial accelerometers and gyroscopes; 9-axis units add magnetometers for heading aiding. Bias instability, noise density, and temperature drift dominate navigation-grade performance — not datasheet range alone. AHRS modules run onboard attitude estimation; tactical-grade and INS/GNSS units add higher-grade gyros and Kalman filtering for survey and outdoor autonomy. Interface choice (I²C vs SPI vs UART vs CAN) affects latency, wiring, and EMI immunity on industrial buses.
Provides high-rate motion measurements for sensor fusion, dead reckoning between absolute fixes, vibration monitoring, and attitude stabilization on mobile and aerial platforms.
Accelerometer + gyroscope packages — dominant MEMS class for fusion on AMRs, drones, and research platforms.
Adds magnetometer for heading aiding — useful when magnetic environment is controlled.
Onboard attitude and heading reference filtering — outputs orientation, not map-frame pose alone.
Higher-grade inertial navigation with tighter bias specs — often paired with GNSS for outdoor robots.
Low-drift gyros for survey, defense, and long-baseline dead reckoning — premium cost and integration.
Consumer to industrial MEMS — cost-effective but drift requires aggressive fusion.
Ruggedized modules with wider temperature and shock ratings for factory and outdoor AMRs.
Combined inertial and satellite navigation boxes — common on outdoor autonomy platforms.
SKU-level comparison is not available yet — use this table to decide what to verify before ordering.
16 selection specs · 13 key for buying decisions
| Spec | Why it matters | Buyer warning |
|---|---|---|
Degrees of freedom Key selection spec 6-axis (accel+gyro); 9-axis (+mag) | 6-axis vs 9-axis sets heading aiding options. | Magnetometers fail near steel and motors. |
Accelerometer range g Key selection spec ±2 g to ±16 g+ MEMS | Clipping on impacts vs resolution tradeoff. | Do not size only for static gravity. |
Gyroscope range °/s Key selection spec ±250 to ±2000 °/s | Saturation on fast rotation breaks fusion. | Drone flips need adequate full-scale. |
Magnetometer Optional detail | Heading aid vs magnetic interference risk. | Often disabled in factory AMRs. |
Bias stability Key selection spec | Gyro bias drives drift integrated over time. | MEMS ≠ tactical grade — verify class. |
Noise density Key selection spec | VIO/LIO performance at slow motion. | Compare angle random walk on datasheet. |
Drift / fusion requirement Key selection spec | IMU alone does not localize. | Plan LiDAR/camera/GNSS/encoder fusion. |
Update rate Hz Key selection spec 100 Hz–1 kHz+ MEMS | Filter bandwidth and control loop headroom. | Bus limits may cap effective rate below datasheet. |
Latency ms Key selection spec | Time sync with LiDAR/camera frames. | Filter pipelines add delay. |
Interface Key selection spec I²C, SPI, UART, CAN, USB, Ethernet | Wiring, EMI, and driver availability. | Long I²C runs pick up motor noise. |
ROS / ROS 2 driver availability Key selection spec | Frame_id and message conventions vary. | Verify driver for exact module revision. |
Calibration support Key selection spec | Uncalibrated MEMS fails fusion benchmarks. | Budget Allan variance / six-pose calibration time. |
Temperature range °C Key selection spec 0–40 °C consumer; −40–85 °C industrial | Bias shifts outdoors and in hot enclosures. | Consumer grade fails on outdoor AMRs. |
Shock / vibration rating Optional detail | Mounting and isolation affect survival. | Chip on vibrating plate without isolation saturates. |
Size / weight Optional detail | Drone payload and AMR CG. | INS boxes heavier than MEMS breakouts. |
Power requirements mA / W Key selection spec 10–50 mA MEMS; higher on INS | Clean rail reduces EMI on analog MEMS. | Share 3.3 V with noisy digital loads carefully. |
Degrees of freedom
6-axis (accel+gyro); 9-axis (+mag)
6-axis vs 9-axis sets heading aiding options.
Magnetometers fail near steel and motors.
Accelerometer range
g
±2 g to ±16 g+ MEMS
Clipping on impacts vs resolution tradeoff.
Do not size only for static gravity.
Gyroscope range
°/s
±250 to ±2000 °/s
Saturation on fast rotation breaks fusion.
Drone flips need adequate full-scale.
Magnetometer
Heading aid vs magnetic interference risk.
Often disabled in factory AMRs.
Bias stability
Gyro bias drives drift integrated over time.
MEMS ≠ tactical grade — verify class.
Noise density
VIO/LIO performance at slow motion.
Compare angle random walk on datasheet.
Drift / fusion requirement
IMU alone does not localize.
Plan LiDAR/camera/GNSS/encoder fusion.
Update rate
Hz
100 Hz–1 kHz+ MEMS
Filter bandwidth and control loop headroom.
Bus limits may cap effective rate below datasheet.
Latency
ms
Time sync with LiDAR/camera frames.
Filter pipelines add delay.
Interface
I²C, SPI, UART, CAN, USB, Ethernet
Wiring, EMI, and driver availability.
Long I²C runs pick up motor noise.
ROS / ROS 2 driver availability
Frame_id and message conventions vary.
Verify driver for exact module revision.
Calibration support
Uncalibrated MEMS fails fusion benchmarks.
Budget Allan variance / six-pose calibration time.
Temperature range
°C
0–40 °C consumer; −40–85 °C industrial
Bias shifts outdoors and in hot enclosures.
Consumer grade fails on outdoor AMRs.
Shock / vibration rating
Mounting and isolation affect survival.
Chip on vibrating plate without isolation saturates.
Size / weight
Drone payload and AMR CG.
INS boxes heavier than MEMS breakouts.
Power requirements
mA / W
10–50 mA MEMS; higher on INS
Clean rail reduces EMI on analog MEMS.
Share 3.3 V with noisy digital loads carefully.
Additional key specs (seed data)
6-axis (accel + gyro) or 9-axis (+ magnetometer)
Magnetometers help heading indoors but suffer magnetic interference on steel AMRs.
±2 g to ±16 g+ typical on MEMS; higher on shock-rated units
Undersized range clips during impacts; oversized range sacrifices resolution.
±250 °/s to ±2000 °/s class-dependent
Fast spins on drones need sufficient full-scale without saturation.
Present on 9-axis modules; absent on many navigation-tuned 6-axis units
Factory magnetic fields bias heading — often disabled in fusion stacks.
MEMS: °/hr class; tactical units orders of magnitude better
Gyro bias drives position drift when integrating without absolute sensors.
Angle random walk and velocity random walk on datasheets
Low noise matters for VIO and LIO at slow motion.
Integrating IMU alone drifts — fusion required for localization
IMU alone is not localization; plan LiDAR/camera/GNSS/encoder fusion.
100 Hz–1 kHz+ on MEMS; higher on tactical INS
Control and LIO loops need consistent high-rate samples.
Filter pipelines and bus timing add milliseconds
Time sync with LiDAR/camera frames critical for fusion quality.
I²C, SPI, UART, CAN, USB, Ethernet on modules and INS boxes
SPI for low latency on MCU; CAN for automotive; Ethernet on INS/GNSS units.
imu_tools, vendor drivers, micro-ROS — model-specific
Verify message type and frame_id conventions before stack integration.
Factory bias trim; user Allan variance / six-pose calibration
Uncalibrated MEMS units fail VIO and LIO benchmarks.
Consumer 0–40 °C vs industrial −40–85 °C class
Outdoor AMRs and hot enclosures shift bias with temperature.
Mounting and potting affect survivability on mobile bases
Vibration isolation and rigid mounts both matter — application-dependent.
Chip-scale MEMS to boxed INS/GNSS units
Payload and CG on drones; mount location on AMR chassis.
~3.3 V / 5 V MEMS at tens of mA; watts on INS boxes
Separate clean power rail reduces EMI coupling on analog sensors.
Prices vary by model, supplier, quantity, availability, and shipping speed. EAR pricing bands are guidance only unless tied to a sourced product record. Verify current pricing before ordering.
imu_mems_module
6-axis and 9-axis MEMS modules for MCU, SBC, and flight-controller integration span hobby to industrial grades. Bias stability class dominates fusion suitability more than price.
Typical buyer
AMR prototypes, drone builders, university robotics labs, MCU fusion stacks.
Examples
SPI/I²C MEMS IMU breakouts and AHRS boards from semiconductor and module vendors.
What affects cost
Price usually excludes
Buyer caution
Source basis
Category-level qualitative guidance — no SKU-linked distributor band yet.
Open research gaps
Verify current pricing with supplier before ordering.
imu_ahrs_industrial
Rugged AHRS and industrial IMU modules with CAN/UART/Ethernet are sold through automation and sensor distributors with configuration support.
Typical buyer
Outdoor AMR integrators, agricultural robotics, industrial vibration monitoring.
Examples
MicroStrain, Xsens-class AHRS modules; industrial IMU boxes with wider temp range.
What affects cost
Price usually excludes
Buyer caution
Source basis
Category-level qualitative guidance — quote-driven on rugged modules.
Open research gaps
Verify current pricing with supplier before ordering.
imu_ins_gnss
GNSS/INS boxes are quoted as navigation systems including antennas, firmware licenses, and support — not commodity MEMS pricing.
Typical buyer
Outdoor autonomy platforms, mapping vehicles, survey and defense robotics programs.
Examples
Tactical and survey-grade INS/GNSS integration boxes.
What affects cost
Price usually excludes
Buyer caution
Source basis
Category-level qualitative guidance — systems pricing common.
Open research gaps
Verify current pricing with supplier before ordering.
Representative product records for orientation — not endorsements.
EAR compatibility guidance is category-level unless a specific product record is sourced. Always verify voltage, current, connectors, signal type, documentation, and manufacturer limits before ordering.
Build chains
Works with
Required companion parts
Optional companion parts
Common interfaces
Voltage / current / power
Software & controller
Mechanical
Buyer mismatch warnings
Emergency substitution notes
Open research gaps
Full cross-component view: Compatibility overview
EAR does not currently verify live stock or delivery speed. Use this guide to avoid ordering the wrong part, then verify stock, shipping, compatibility, and datasheets with the supplier before purchase.
Urgency summary
IMU failures in fusion stacks rarely allow blind substitution — interface, bias class, calibration, and time-sync with LiDAR/cameras must match first.
Check stock and shipping live before ordering.
Urgent questions
Acceptable substitutions (category-level)
Dangerous substitutions
Suppliers to check first
Local pickup targets (verify stock)
Marketplace cautions
Before you order
After arrival — bench test
If you get it wrong
Open research gaps
IMUs feed EKF/graph fusion with wheel encoders, LiDAR, cameras, and GNSS — plan extrinsic calibration, time synchronization (PTP/hardware sync), and vibration isolation. Cheap MEMS drifts quickly without fusion. AHRS outputs are not a substitute for localization-grade INS on survey tasks.
7 manufacturers tracked — expand for chips and dossier links.
EAR does not currently show live inventory. Always verify stock, shipping speed, compatibility, and authorized-channel status before ordering.
Supported categories
Broad authorized catalog for semiconductors and modules
Buyer caution
MEMS IMU breakouts and modules — verify stock
Supported categories
Wide semiconductor and module selection
Buyer caution
Industrial and MEMS IMU lines — shipping verification needed
Supported categories
Broad robotics catalog in one place
Buyer caution
Research IMU boards for rovers and drones
Supported categories
Authorized distributor for many semiconductor lines
Buyer caution
Industrial sensor distribution — verify authorization
Supported categories
Broad industrial catalog
Buyer caution
Industrial automation channel — regional stock varies
Browse all suppliers in the Supplier Directory. See what works together in the Compatibility Matrix.
Overnight availability needs live supplier verification. EAR does not track live inventory.
STOCK & SHIPPING
Overnight availability: needs live supplier verification. EAR does not track live inventory.
For rush-order decision checklists, see Emergency sourcing guide above.
Likely supplier targets to check first
See Who sells it above for supplier targets and sourcing guidance — then verify stock and shipping live before ordering.
Emergency sourcing checklist
Gyro bias drift causing position walk without fusion
Replacement parts risk
Low for commodity MEMS breakouts; medium for calibrated AHRS/INS — replacement often requires field recalibration and fusion retuning.
Cheap IMUs drift. Calibration matters. An IMU alone is not localization — fuse with LiDAR, cameras, encoders, or GNSS. Vibration isolation and temperature drift dominate field performance.
Cheap IMUs drift. Calibration matters. An IMU alone is not localization — fuse with LiDAR, cameras, encoders, or GNSS. Vibration isolation and temperature drift dominate field performance.
USD bands by IMU class (MEMS / AHRS / INS)
CURRENT STATUS
Needs sourced range
NEXT EVIDENCE TARGET
Authorized distributor listing spot-checks
Model-level ROS 2 driver and frame convention matrix
CURRENT STATUS
Category guidance only
NEXT EVIDENCE TARGET
Verified driver records per module family
LIO/VIO stack pairing guides with LiDAR and camera classes
CURRENT STATUS
Anecdotal only
NEXT EVIDENCE TARGET
Integrator reference architectures
Published product records for this component family are still being added. Browse the product catalog or use Engineering Copilot to explore related products.